The small vacuum hot press machine has increased the temperature control range and upgraded the temperature control setting program, and is used for medium to low temperature bonding of substrates such as glass, silicon wafers, crystal cells, sapphire, quartz, etc. It is a specialized equipment for silicon-based hot press bonding processing. The vacuum hot press bonding machine can not only meet the requirements of low to medium temperature bonding under different gases, but also meet the requirements of low to medium temperature annealing in a vacuum environment; The temperature during the high and low temperature bonding and medium and low temperature annealing processes can be flexibly set and programmed; The bonding pressure can also be programmed and controlled within the range. (35T hot press with preheating table)